Multifunctional Wide-Density Plasma System, developed by Metathermo (Suzhou) Energy Technology Co., Ltd., is a compact, research-grade vacuum plasma processing platform that integrates the advantages of Inductively Coupled Plasma (ICP) and Capacitively Coupled Plasma (CCP) glow discharge. The system achieves stable discharge across a wide density range of 10⁸–10¹³ cm⁻³, enabling both damage-free surface modification of atomically thin layers using extremely low-density plasma, and high-efficiency etching and thin-film deposition assistance in high-density mode. It is well suited for research on novel 2D materials, photovoltaics, semiconductor processes, and functional coatings.
Magnetron Sputtering System is a compact, research-grade high-vacuum PVD platform built around a 316 stainless steel chamber with turbo-molecular pumping for ultra-clean deposition. It supports single/multi-target and co-sputtering of metals, alloys, dielectrics, and multilayer stacks, with DC/RF switchable power, 800 °C PID-heated rotating stage, and customizable configurations. The system balances research flexibility with engineering reliability, enabling damage-free interface engineering and high-quality film growth. It is well suited for semiconductor materials, 2D materials, optoelectronics, energy-storage electrodes, and functional coating research.
Electron Beam Evaporation System is a compact, research-grade high-vacuum PVD platform featuring a 316 stainless steel chamber and multi-crucible e-beam source for precise deposition of metals, semiconductors, oxides, and multilayer films. Compared with resistive evaporation, it focuses energy on a localized crucible spot, enabling stable processing of refractory metals and high-melting-point materials. With INFICON thickness monitoring, an 800 °C PID-heated rotating stage, and turbo-pumped ultra-clean environment, the system delivers both single-layer electrodes and complex heterostructures. It is well suited for microelectronics, optoelectronics, 2D materials, and quantum device research.
Thermal Evaporation System is an entry-level, research-grade high-vacuum PVD platform with a vertical bell-jar stainless steel chamber. It evaporates metals and organics by resistive heating to deposit conductive films, semiconductor layers, ferroelectric films, optical coatings, and organic small-molecule layers. Compared with e-beam evaporation, it offers simpler structure, lower cost, and a gentler learning curve. Integrating metal sources and quartz-crucible organic sources, it handles Au/Ag/Cr/Ti electrodes, OLED/OPV molecules, and polymer precursors—ideal for fast sample changes and combined organic/metal processes. It is well suited for microelectronics, optoelectronics, 2D-material contacts, and teaching laboratories.
The ALD product family covers single-chamber and dual-chamber atomic layer deposition systems for research and pilot-scale fabrication. Based on precise, pulse-wise precursor dosing, both platforms enable conformal thin-film growth on planar wafers, 3D complex substrates, powders, particles, porous media, and high-aspect-ratio structures. The vacuum system offers multiple pump options with lines bakeable to 200 °C and a 300 °C foreline thermal trap for clean background. With Swagelok ALD valves, heated precursor lines, PLC + touchscreen control, and optional glovebox/Ozone/QCM integration, the systems serve oxide, nitride, metal, and hybrid thin-film applications from 4-inch to 12-inch substrates. Ideal for 2D materials, photovoltaics, semiconductor processes, and functional coatings research.
