Electron Beam Evaporation Coating System
Electron Beam Evaporation System is a high-vacuum physical vapor deposition (PVD) platform designed for universities, research institutes, and pilot-scale advanced material development. Housed in a 316 stainless steel high-vacuum chamber with a multi-crucible e-beam source, the system efficiently deposits different metals and multilayer films. It is particularly suitable for microelectronics, optoelectronics, 2D materials, and quantum device research where evaporation rate, thickness uniformity, and interface cleanliness are critical.
Product Image
Core Capabilities
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316 Stainless Steel High-Vacuum Chamber
The Φ500 × 650 mm chamber is constructed from 316 stainless steel with a front-opening door, omnidirectional viewport with shutter, and CF200/CF250 knife-edge flanges. The design ensures low leak rate, bakeability, and easy cleaning for daily research use. -
Multi-Crucible Electron Beam Source
Available with 4–6 crucibles or a planetary/ring crucible e-gun, with water-cooled crucible holders to avoid cross-contamination. Enables sequential evaporation of Ag, Au, Ti, Pt, Cr and more. Resistive evaporation sources or effusion cells can be added for low-melting-point materials and OLED/small-molecule organic films. -
Real-Time Thickness Monitoring
Standard INFICON 310 / XTM series quartz crystal monitor provides real-time film thickness and rate control, improving repeatability of multilayer stacks and device yield. -
Heated Rotating Sample Stage
Accepts 1–4 inch substrates with 0–20 rpm adjustable rotation for uniformity. Heating up to 800 °C with Japanese conductivity-meter PID control (±0.5 °C) supports high-temperature deposition, in-situ annealing, and stress engineering. -
High-Vacuum, Low-Contamination Environment
Mechanical pump + turbo-molecular pump train reaches an ultimate vacuum of ≤5×10⁻⁵ Pa. Combined ionization/Pirani gauges help maintain a clean residual-gas environment for oxygen/moisture-sensitive films such as semiconductors, superconductors, and 2D-material contacts. -
Expandable and Service-Friendly
E-gun power, resistive sources, effusion cells, gas lines, and sample stages can be customized. Turnkey installation and training make the system practical for labs without dedicated vacuum engineers.
Technical Specifications
| Item | Specification |
|---|---|
| Evaporation Source | Electron beam evaporation (resistive / effusion cell optional) |
| E-Gun | 4–6 crucibles or ring crucible, water-cooled |
| E-Gun Power | 8 kW (optional) |
| Thickness Monitor | INFICON 310 / XTM series |
| Sample Stage | 1–4 inch; rotation 0–20 rpm adjustable |
| Heating Temperature | ≤800 °C, PID control, accuracy ±0.5 °C |
| Chamber Material and size | 316 stainless steel; top/bottom plates 316 SS; Φ500 × 650 mm |
| Viewport | Omnidirectional view, with shutter |
| Ultimate Vacuum | 5×10⁻⁵ Pa |
| Vacuum Measurement | Ionization gauge + Pirani/resistance gauge |
| Flange Interfaces | Pumping CF200/CF250, exhaust KF25, gas inlet φ6 ferrule |
| Power Supply and Total Power | AC 380 V, 50 Hz; 10 kW |
| Dimensions | 800 × 920 × 870 mm |
| Weight | Approx. 200 kg |
Typical Applications
- Microelectronics & Semiconductors: Ti/Au/Cr/Pt contacts, seed layers, interconnect metals
- Optoelectronics: OLED/OPV small-molecule evaporation, AR/HR coatings, transparent conductors
- 2D Materials & Quantum Devices: metal contacts for graphene/hBN devices, superconducting films, Josephson junction base layers
- Energy & Catalysis: current-collector metal films, catalytic thin films, solid-state battery buffer layers
- General Research Films: single/multilayer calibration samples for XRD, TEM, SEM, and electrical characterization